PCB

PCB2018-09-25T11:35:26+00:00

Project Description

PCB (Printed Circuit Board)

According to the circuit design, the electrical wiring connecting the circuit components is formed into a wiring pattern, and then the circuit board formed by recreating the electrical conductor on the insulator is performed by mechanical processing, surface treatment, or the like specified by the design.
The manufacturing process of the circuit board is to use the printing, photographic, etching and electroplating technologies to manufacture precision wiring, and to be an assembly base for supporting electronic parts and circuits between the parts. Therefore, the high-density and multi-layered wiring forming technology has become the mainstream of the development of the printed circuit board manufacturing industry.
It will appear in almost every electronic device. If there are electronic parts in a certain device, they are also mounted on different sizes of PCB.

CategoryDescription Capability
File formGerber GERBER
Drilling fileX, Y axis position. and aperture size
SizeMaximum
finished size
490mm x 590mm
Plate
thickness
Standard
thickness
1.6mm +/- 10% (0.062” +/- 10%)
Minimum
thickness
Single panel: 1.0mm +/- 0.076mm (0.012”+/-0.003”)
Maximum
thickness
2.0mm +/- 10% (0.126” +/- 10% )
Aluminum plate Yes
DrillingMinimum
aperture
0.040” (1.0mm)
Outer layer
etching
Minimum line width / pitch (1oz)
bottom copper
0.008” / 0.008” (0.2mm)
Minimum line width / pitch (2oz)
bottom copper
0.020” / 0.020” (0.5mm)
Line width tolerance+/- 20%
Anti-weldingColorGreen, yellow, red, blue, black, white
Minimum
anti-welding ink
0.004”
Solder resist
thickness
0.004”
TextColorWhite, black, yellow, red, blue, green
Minimum ink
line width
0.005”
Minimum word
height/word width
0.028” / 0.028”
Electrical
test
Flying probe test Yes
Open circuit / short circuitYes
CNC Molding tolerance+/- 0.15mm (0.006”)
V-Cut Depth (one side 1/3 deep)+/- 0.1mm (0.004”)
V-Cut angle40° +/- 10°
V-Cut Offset+/- 0.1mm (0.004”)
Semi-circular holeYes
Surface
treatment
Spray tin / lead-free spray tinYes
GoldYes
OSP Organic surface treatmentYes
ElseUL (Underwriters Laboratory) According to customer requirements
Date CodeAccording to customer requirements
StandardIPC-600 
Acceptance criteria
Class II