製程能力 Capability

Min. Thickness.4L: 0.016″(0.4mm)
 6L: 0.024″(0.6mm)
 8L: 0.032″(0.6mm)
Max. Working Panel Size20″ X 24″(508 X 608mm)
Inner Layer TreatmentBlack Oxide 
Min. Line / Space Width0.004″/ 0.004″(0.1/0.1mm)
Min. Hole Diameter (finished)0.008″(0.20mm)
Min. Land Diameter0.016″(0.40mm)
Min. SMT Pitch0.012″(0.30mm)
Max. No. of Layers8 Layers 
Plating Aspect ratio6:1 
FinishHAL(no lead), Gold Plating, Entek

目前產能 Current Capability

Single-sided:30,000 ft2
Double-sided:50,000 ft2
Multi-layers:20,000 ft2

產品類別分佈 Classification of Product