製程能力 Capability
| Min. Thickness. | 4L: 0.016″ | (0.4mm) |
| 6L: 0.024″ | (0.6mm) | |
| 8L: 0.032″ | (0.6mm) | |
| Max. Working Panel Size | 20″ X 24″ | (508 X 608mm) |
| Inner Layer Treatment | Black Oxide | |
| Min. Line / Space Width | 0.004″/ 0.004″ | (0.1/0.1mm) |
| Min. Hole Diameter (finished) | 0.008″ | (0.20mm) |
| Min. Land Diameter | 0.016″ | (0.40mm) |
| Min. SMT Pitch | 0.012″ | (0.30mm) |
| Max. No. of Layers | 8 Layers | |
| Plating Aspect ratio | 6:1 | |
| Finish | HAL(no lead), Gold Plating, Entek | |
目前產能 Current Capability
產品類別分佈 Classification of Product